Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated – With specified encapsulant
Patent
1995-08-07
1996-10-22
Mintel, William
Active solid-state devices (e.g., transistors, solid-state diode
Encapsulated
With specified encapsulant
257793, 257795, H01L 2329
Patent
active
055679900
ABSTRACT:
A resin-encapsulated semiconductor which is free from the occurrence of blisters or cracks during soldering, suits for continuous production and has excellent moisture resistance reliability is obtained by using an epoxy resin encapsulating material which comprises
REFERENCES:
patent: 5294835 (1994-03-01), Igarashi et al.
Horie Osamu
Kawata Tatsuo
Miyabayashi Kazuhiko
Sashima Hiroki
Suzuki Hiroshi
Hitachi Chemical Company Ltd.
Mintel William
Potter Roy
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