Active solid-state devices (e.g. – transistors – solid-state diode – Physical configuration of semiconductor – With peripheral feature due to separation of smaller...
Reexamination Certificate
2007-12-11
2007-12-11
Pert, Evan (Department: 2826)
Active solid-state devices (e.g., transistors, solid-state diode
Physical configuration of semiconductor
With peripheral feature due to separation of smaller...
C257S737000, C257S773000, C257S778000, C257SE23002, C257SE23020, C257SE23021, C438S462000, C438S614000
Reexamination Certificate
active
11118440
ABSTRACT:
A semiconductor apparatus includes a semiconductor device to be mounted on a circuit board; a plurality of conductive posts electrically connected to the semiconductor device; and a plurality of conductive bumps each provided on an outer end of each of the conductive posts, so that the plurality of conductive bump is soldered onto the circuit board when the semiconductor device is mounted on the circuit board. A distance between a peripheral edge of the semiconductor device and an outer edge of the conductive post is determined to be narrow so that a solderbility or wetting condition of the conductive bumps can be visibly recognized easily.
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Ohuchi Shinji
Shiraishi Yasushi
Tanaka Yasuo
Oki Electric Industry Co. Ltd.
Pert Evan
Rabin & Berdo P.C.
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