Resin-mold type semiconductor device

Details Resin-mold type semiconductor device Resin-mold type semiconductor device

1997-10-08

1999-08-17

Arroyo, Teresa M.

Active solid-state devices (e.g., transistors, solid-state diode

Encapsulated

With specified encapsulant

257787, 257789, 257792, H01L 2328, H01L 2329

Patent

active

059397926

ABSTRACT:
A resin-mold type semiconductor device includes a semiconductor chip, a die pad for supporting and fixing the semiconductor chip, a plurality of inner leads whose distal ends face the semiconductor chip, a plurality of outer leads integrally connected to the corresponding inner leads, bonding wires for electrically connecting distal end portions of the inner leads to terminal electrodes of the semiconductor chip, a resin-mold package for molding the die pad, the semiconductor chip, the inner leads and the bonding wires, and a highly water-absorbent insulating film made of highly water-absorbent polymer formed at least one portion of the surface of the resin-mold package.

REFERENCES:
patent: 4788583 (1988-11-01), Kawahara et al.
patent: 5346743 (1994-09-01), Uchida et al.
patent: 5594204 (1997-01-01), Taylor et al.

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