Resin-molded semiconductor device having posts with bumps

Details Resin-molded semiconductor device having posts with bumps Resin-molded semiconductor device having posts with bumps

2005-06-28

2005-06-28

Pert, Evan (Department: 2829)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With semiconductor element forming part

C257S730000

Reexamination Certificate

active

06911722

ABSTRACT:
A semiconductor apparatus includes a semiconductor device to be mounted on a circuit board; a plurality of conductive posts electrically connected to the semiconductor device; and a plurality of conductive bumps each provided on an outer end of each of the conductive posts, so that the plurality of conductive bump is soldered onto the circuit board when the semiconductor device is mounted on the circuit board. A distance between a peripheral edge of the semiconductor device and an outer edge of the conductive post is determined to be narrow so that a solderbility or wetting condition of the conductive bumps can be visibly recognized easily.

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