Resin-molded semiconductor device and lead frame employed for fa

Details Resin-molded semiconductor device and lead frame employed for fa Resin-molded semiconductor device and lead frame employed for fa

1992-09-11

1994-03-01

Clark, Sheila V.

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

257676, 257674, H01L 2348, H01L 2944, H01L 2952, H01L 2960

Patent

active

052910598

ABSTRACT:
A semiconductor device has a lead, an inner lead of which is upwardly bent while an outer lead is downwardly bent. A junction part of the outer lead is guided from a resin block on a level which is lower than that of an upper major surface of the semiconductor chip. In fabrication of this semiconductor device, a guide frame of a lead frame, a suspending lead and a die pad held by the same are flush with each other.

REFERENCES:
patent: 4698660 (1987-10-01), Kubota et al.
patent: 4891687 (1990-01-01), Mallick et al.
patent: 5089879 (1992-02-01), Komenaka
patent: 5105259 (1992-04-01), McShane et al.

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