Resin-encapsulated semiconductor device having a passivation rei

Details Resin-encapsulated semiconductor device having a passivation rei Resin-encapsulated semiconductor device having a passivation rei

1993-03-02

1994-02-15

James, Andrew J.

Active solid-state devices (e.g., transistors, solid-state diode

Encapsulated

With specified encapsulant

257787, 257790, H01L 2348, H01L 2328

Patent

active

052870030

ABSTRACT:
A semiconductor device is provided with a polyimide film 21 between the encapsulating synthetic resin 16 and the passivating film 20. If a material having a high hardness (E-modulus.gtoreq.1.0.multidot.10.sup.10 Pa) is selected as the polyimide, the number of defects caused by variations in temperature is reduced.

REFERENCES:
patent: 4951122 (1990-08-01), Tsubosaki et al.

Affiliated with

Also associated with

Rating

Resin-encapsulated semiconductor device having a passivation rei does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Resin-encapsulated semiconductor device having a passivation rei, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Resin-encapsulated semiconductor device having a passivation rei will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1209593