Resin-molded semiconductor device

Details Resin-molded semiconductor device Resin-molded semiconductor device

2005-03-01

2005-03-01

Williams, Alexander Oscar (Department: 2826)

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

C257S684000, C257S796000, C257S672000, C257S671000, C257S670000, C257S676000, C257S698000, C257S787000

Reexamination Certificate

active

06861734

ABSTRACT:
In a leadframe for an LGA package, a lead member is pressed downward to form a land lead with a half-cut portion and a land portion. The land portion, whose bottom will be a land electrode, is inclined at a predetermined angle and the bottom of the land portion is made lower than that of a lead. Thus, in a resin molding process using a seal sheet, the land electrode is forced into, and strongly adhered to, the seal sheet when pressure is applied through dies, and no resin encapsulant reaches the land electrode. As a result, no resin bur will be left on the land electrode of the land lead.

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