Resin-encapsulated semiconductor device

Details Resin-encapsulated semiconductor device Resin-encapsulated semiconductor device

1994-10-27

1996-07-16

Monin, Jr., Donald L.

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

With structure for mounting semiconductor chip to lead frame

257783, 257790, H01L 2350, H01L 2328

Patent

active

055369707

ABSTRACT:
A resin-encapsulated semiconductor device having a semiconductor chip mounted on a die pad with a die bonding portion interposed, a lead arranged in a periphery of the die pad and electrically connected with a bonding pad portion of the semiconductor chip, and an encapsulating resin layer which encapsulates the semiconductor chip so that a part of the lead is guided to the outside, wherein an adhesive resin layer is interposed at least either between the die pad and the die bonding portion is described, or between the semiconductor chip and the die bonding portion.

REFERENCES:
patent: 5049976 (1991-09-01), Demmin et al.
patent: 5140404 (1992-08-01), Fogel et al.
patent: 5173765 (1992-12-01), Nakayoshi et al.

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