Resin-encapsulated semiconductor device having improved adhesion

Details Resin-encapsulated semiconductor device having improved adhesion Resin-encapsulated semiconductor device having improved adhesion

1992-12-07

1996-05-07

Jackson, Jerome

Active solid-state devices (e.g., transistors, solid-state diode

Encapsulated

257687, 257774, 257678, H01L 2328, H01L 2348, H01L 2946, H01L 2954

Patent

active

055149138

ABSTRACT:
A package for discrete semiconductor devices, wherein the insulating characteristics of the package are improved by introducing an opening, indentations, grooves and positioning holes in the metal plate and shaping in appropriate form the retractable positioning pins of the metal plate in the molding die.

REFERENCES:
patent: 4266267 (1981-05-01), Ruegg
patent: 4888307 (1989-12-01), Spairisano et al.
patent: 5063434 (1991-11-01), Emoto
patent: 5105259 (1992-04-01), McShane et al.

Affiliated with

Also associated with

Rating

Resin-encapsulated semiconductor device having improved adhesion does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Resin-encapsulated semiconductor device having improved adhesion, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Resin-encapsulated semiconductor device having improved adhesion will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1229051