Resin-encapsulated semiconductor memory device useful for single

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With structure for mounting semiconductor chip to lead frame

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

Other Related Categories

257692, 257696, 257773, 257787, 174 524, 361813, 365 51, H01L 2348, H01L 2944, H01L 2710, H02G 308

Type

Patent

Status

active

Patent number

052870006

Description

ABSTRACT:
According to one aspect of the present invention, a semiconductor chip, which can be mounted in a zigzag in-line type package (ZIP) partially using a tabless lead frame, includes bonding pads arranged on the chip so that the chip can be applied also to other different types of packages. These different types of packages include a small out-line J-bent type package (SOJ) which uses a lead frame with tab, and a dual in-line type package (DIP) which uses a tabless lead frame. Further, a plurality of bonding pad pairs are provided amongst the bonding pads on the chip, each pad of such bonding pad pairs having the same function as the other pad associated therewith thereby duplicating a common function in different bonding pads on the semiconductor chip so as to make the semiconductor chip compatible with a variety of or different types of packages. In accordance with another aspect of the invention, a resin-encapsulated semiconductor device of the ZIP structure is provided in which a semiconductor pellet having a plurality of external terminals disposed on a device-forming surface along each side of the planar shape is encapsulated with a resin, wherein inner leads for signals connected electrically with external terminals, disposed opposing to the surface of the resin-encapsulated portion disposed with outer leads and disposed along the most remote side of the semiconductor pellet, are arranged so as to overlap the semiconductor pellet.

REFERENCES:
patent: 4934820 (1990-06-01), Takahashi et al.
patent: 5097440 (1992-03-01), Konishi et al.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Resin-encapsulated semiconductor memory device useful for single does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Resin-encapsulated semiconductor memory device useful for single, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Resin-encapsulated semiconductor memory device useful for single will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-1209545

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.