Resin-molded package with cavity structure

Details Resin-molded package with cavity structure Resin-molded package with cavity structure

2007-03-06

2007-03-06

Andujar, Leonardo (Department: 2826)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Insulating material

C206S710000, C257S787000, C438S125000

Reexamination Certificate

active

11186794

ABSTRACT:
A package includes: a substrate having a ridged peripheral portion and a center portion defined by and lower in level than the ridged peripheral portion. A semiconductor chip is mounted on the center portion. A plurality of lead is electrically coupled to the semiconductor chip and penetrates the substrate outwardly from the center portion. The package also includes a cap defining a cavity space which accommodates the semiconductor chip. The cap has a cap bonding face bonded with a substrate bonding face of the ridged peripheral portion. The cap bonding face and the substrate bonding face are higher in level than the center portion.

REFERENCES:
patent: 5949655 (1999-09-01), Glenn
patent: 6011303 (2000-01-01), Tanaka et al.
patent: 6483030 (2002-11-01), Glenn et al.
patent: 1 096 563 (2001-05-01), None
patent: 2600689 (1997-01-01), None
patent: 3127584 (2000-11-01), None
patent: 2000006598 (2000-02-01), None

Affiliated with

Also associated with

Rating

Resin-molded package with cavity structure does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Resin-molded package with cavity structure, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Resin-molded package with cavity structure will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3726593