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High density integrated circuit packages and method for the...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Flip chip
Reexamination Certificate

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High density integrated circuit packaging with chip stacking and

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified configuration
Patent

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High density integrated circuit packaging with chip stacking...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified configuration
Reexamination Certificate

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High density integrated circuit pad structures

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Configuration or pattern of bonds
Patent

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High density integrated circuits using tapered and...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified configuration
Reexamination Certificate

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High density integrated semiconductor device

Active solid-state devices (e.g. – transistors – solid-state diode – Field effect device – Having insulated electrode
Patent

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High density integrated semiconductor memory and method for prod

Active solid-state devices (e.g. – transistors – solid-state diode – Field effect device – Having insulated electrode
Patent

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High density interconnect structure including a chamber

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
Patent

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High density interconnect structure including a spacer structure

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified material other than unalloyed aluminum
Patent

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High density interconnect substrate and method of manufacturing

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Bump leads
Patent

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High density interconnected circuit module with a compliant laye

Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated – With specified encapsulant
Patent

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High density lead frames and methods for plastic injection...

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame
Reexamination Certificate

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High density leaded ball-grid array package

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Beam leads
Patent

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High density LED array

Active solid-state devices (e.g. – transistors – solid-state diode – Incoherent light emitter structure – Plural light emitting devices
Reexamination Certificate

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High density LED arrays with semiconductor interconnects

Active solid-state devices (e.g. – transistors – solid-state diode – Incoherent light emitter structure – Plural light emitting devices
Patent

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High density local interconnect in a semiconductor circuit using

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified material other than unalloyed aluminum
Patent

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High density memory and double word ferroelectric memory cell fo

Active solid-state devices (e.g. – transistors – solid-state diode – Field effect device – Having insulated electrode
Patent

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High density memory array

Active solid-state devices (e.g. – transistors – solid-state diode – Gate arrays – With particular signal path connections
Reexamination Certificate

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High density memory array having increased channel widths

Active solid-state devices (e.g. – transistors – solid-state diode – Non-single crystal – or recrystallized – semiconductor... – Field effect device in non-single crystal – or...
Reexamination Certificate

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High density memory array having increased channel widths

Active solid-state devices (e.g. – transistors – solid-state diode – Folded bit line dram configuration
Reexamination Certificate

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