High density interconnect structure including a spacer structure

Details High density interconnect structure including a spacer structure High density interconnect structure including a spacer structure

1990-07-02

1994-08-16

Sotomayor, John B.

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Of specified material other than unalloyed aluminum

257758, 257760, 257700, 361764, 361783, H01L 2348, H01L 2946, H01L 2954

Patent

active

053389751

ABSTRACT:
A high frequency electronic component which is interconnected with other components through a high density interconnect structure sees only an air dielectric constant in the high density interconnect structure because a spacer structure disposed on the electronic component spaces the dielectric of the high density interconnect structure from the surface of the electronic component by a sufficient distance that the higher dielectric constant of the polymer dielectric layers of the high density interconnect structure only minimally affects the operating characteristics of the electronic components.

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patent: 5017434 (1991-05-01), Enloe et al.
patent: 5025306 (1991-06-01), Johnson et al.

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