Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated – With specified encapsulant
Patent
1995-11-30
1999-02-02
Chaudhuri, Olik
Active solid-state devices (e.g., transistors, solid-state diode
Encapsulated
With specified encapsulant
257724, 257687, 257701, H01L 2329
Patent
active
058669523
ABSTRACT:
A high density interconnected multi-chip module is provided with a stress-reducing compliant material disposed around the chips prior to molding a polymeric substrate around the chips. Chips having contact pads are placed face down on a layer of adhesive supported by a base. A compliant material is deposited around the chips, and then a mold form is positioned around the chips. Polymeric substrate molding material is added within the mold form, and then the substrate molding material is hardened. A dielectric layer having vias aligned with predetermined ones of the contact pads and having an electrical conductor extending through the vias is situated on the hardened substrate molding material and faces of the chips. A thermal plug may be affixed to the backside of a chip prior to the addition of substrate molding material.
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Gorczyca Thomas Bent
Weaver, Jr. Stanton Earl
Wojnarowski Robert John
Chaudhuri Olik
Kelley Nathan K.
Krauss Geoffrey H.
Lockheed Martin Corporation
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