Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Beam leads
Patent
1996-09-20
1998-12-29
Thomas, Tom
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Beam leads
257737, 257738, 257780, 257690, H05K 118, H05K 720, H01L 2328, H01L 2336
Patent
active
058545123
ABSTRACT:
A high density leaded ball-grid array package for packaging an integrated-circuit die includes a laminated substrate formed of a non-conductive layer sandwiched between first and second conductive trace patterns. A leadframe is directly attached onto the first conductive trace pattern of the laminated substrate by a non-conductive adhesive so that the open portion thereof overlies a central region of the laminated substrate. An integrated-circuit die is mounted in the central region of the laminated substrate. Bonding wires are interconnected between bonding pads formed on the integrated-circuit die and bonding fingers formed on the leadframe. A plastic material is molded over the top surface of the die, bonding fingers and bonding wires. A solder mask is applied on the second conductive trace pattern so as to form selective solderable areas. Finally, solder balls are attached to the selective solderable areas.
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Chin Davis
King Patrick T.
Thomas Tom
VLSI Technology Inc.
Williams Alexander Oscar
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