LandOfFree - US Patents - Listing for Active solid-state devices (e.g., transistors, solid-state diode

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Die bond

Flip chip mounting method and semiconductor apparatus manufactur

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – On insulating carrier other than a printed circuit board

Flip chip mounting substrate with resin filled between substrate

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Flip chip

Flip chip mounting type semiconductor device

Active solid-state devices (e.g. – transistors – solid-state diode – Incoherent light emitter structure – With reflector – opaque mask – or optical element integral...

Flip chip nitride semiconductor light emitting diode

Active solid-state devices (e.g. – transistors – solid-state diode – Responsive to non-electrical signal – Electromagnetic or particle radiation

Flip chip on glass sensor package

Active solid-state devices (e.g. – transistors – solid-state diode – Responsive to non-electrical signal – Electromagnetic or particle radiation

Flip chip optical semiconductor on a PCB

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Flip chip

Flip chip package

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Flip chip

Flip chip package

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified material other than unalloyed aluminum

Flip chip package and method for manufacturing the same

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents

Flip chip package and method of making

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material

Flip chip package capable of measuring bond line thickness...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Flip chip

Flip chip package compatible with multiple die footprints...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Flip chip package for micromachined semiconductors

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material

Flip chip package including a non-planar heat spreader and...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Flip chip

Flip chip package module and method of forming the same

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – For high frequency device

Flip chip package of monolithic microwave integrated circuit

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Flip chip

Flip chip package structure

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material

Flip chip package structure

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Flip chip

Flip chip package structure