Flip chip package

Details Flip chip package Flip chip package

1998-10-28

1999-11-23

Thomas, Tom

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Flip chip

257779, 257780, 257678, 257687, H01L 2349

Patent

active

059905654

ABSTRACT:
The invention is related to a new technology for improving a flip chip package. It is characterized by that at least one pad and at least one lead are formed on the surface of one side of a chip, part of each lead is covered by liquid compound and whereby another part of said lead which is exposed beyond the surface of said liquid compound is available for electrical connection. According to the invention, wire bonding can be easily applied in forming leads for flip chip package, and better connection structure can be achieved, thereby the manufacturing process of integrating the chip and printed circuit board becomes easy. Furthermore the pad on the surface of the chip is thermally conductive, helping the conduction of heat from the chip to the printed circuit board, thereby promotes the effect of protecting the chip.

REFERENCES:
patent: 5285352 (1994-02-01), Pastore et al.
patent: 5412247 (1995-05-01), Martin
patent: 5530286 (1996-06-01), Murakami
patent: 5583375 (1996-12-01), Tsubosaki et al.
patent: 5677566 (1997-10-01), King et al.
patent: 5739585 (1998-04-01), Akram et al.
patent: 5793104 (1998-08-01), Kirkman

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