Flip chip mounting type semiconductor device

Details Flip chip mounting type semiconductor device Flip chip mounting type semiconductor device

1996-04-24

1998-09-01

Thomas, Tom

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Flip chip

257786, 257787, H01L 2348

Patent

active

058014470

ABSTRACT:
In a flip chip mounting type semiconductor device, on a corner portion of a chip subjected to flip chip mounting, a gate region for injecting a sealing member filled between a mounted board and the chip is arranged. In this semiconductor device, a semiconductor element has a plurality of bumps formed on the peripheral portion on a major surface along each side, a plurality of pad electrodes are formed on the major surface of the circuit board, and the pad electrodes join the bumps. A resin sealing member is filled between the semiconductor element and the circuit board. A gate region through which the resin sealing member is injected is formed on a corner portion of the semiconductor element. In the gate region, no bump is formed, or bumps are arranged at intervals smaller than that in another region. For this reason, the resin uniformly enters the space between the semiconductor element and the circuit board through the gate region.

REFERENCES:
patent: 4021838 (1977-05-01), Warwicck
patent: 5647123 (1997-07-01), Greenwood et al.

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