Flip chip mounting substrate with resin filled between substrate

Details Flip chip mounting substrate with resin filled between substrate Flip chip mounting substrate with resin filled between substrate

1998-08-20

2000-04-11

Thomas, Tom

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

On insulating carrier other than a printed circuit board

257778, 257737, 257701, 257678, 257780, 438108, 438127, H01L 23495

Patent

active

060491221

ABSTRACT:
A semiconductor device and method to control generation of a void within resin during supply to an area between a semiconductor chip and a substrate body. The substrate body includes a wiring layer which is connected to an external bump through internal wiring. Solder resist is formed on the substrate body and an aperture in the solder resist exposes a plurality of pads to electrically connect with the semiconductor chip. During loading of the semiconductor chip, the resin is supplied to the aperture. The aperture is formed in a circumferential shape to control generation of the void.

REFERENCES:
patent: 5683942 (1997-11-01), Kata et al.
patent: 5710071 (1998-01-01), Beddingfield et al.
patent: 5869886 (1999-02-01), Tokuno
U.S. application No. 09/034,799, Sohara et al., filed Mar. 4, 1998.

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