Flip chip package structure

Details Flip chip package structure Flip chip package structure

2006-03-28

2006-03-28

Pham, Hoai (Department: 2814)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Flip chip

C257S737000

Reexamination Certificate

active

07019407

ABSTRACT:
A flip chip package structure comprising a chip, a substrate, at least a first bump and a plurality of second bumps is provided. The chip has a first bump-positioning region and the substrate has a second bump-positioning region. The substrate has at least a first hole and multiple second holes. The first hole and the second holes are located within the second bump-positioning region. The first hole has a depth greater than that of the second hole. The first bump is set up between the first bump-positioning region of the chip and the second bump-positioning region of the substrate. The first bump is bonded to the substrate through the first holes. The second bumps are set up between the first bump-positioning region of the chip and the second bump-positioning region of the substrate. The second bumps are bonded to the substrate through the second holes. The first bump has a volume greater than the volume of the second bump.

REFERENCES:
patent: 5352926 (1994-10-01), Andrews
patent: 6150724 (2000-11-01), Wenzel et al.
patent: 6586844 (2003-07-01), Chang
patent: 6768190 (2004-07-01), Yang et al.
patent: 6774498 (2004-08-01), Hsu et al.
patent: 6825568 (2004-11-01), Hung

Affiliated with

Also associated with

Rating

Flip chip package structure does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Flip chip package structure, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Flip chip package structure will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3587178