Flip chip package structure

Details Flip chip package structure Flip chip package structure

2006-02-28

2006-02-28

Nelms, David (Department: 2818)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Flip chip

C438S108000

Reexamination Certificate

active

07005749

ABSTRACT:
A flip chip package structure includes a substrate, a chip, solder bumps, a heat sink, a thermal interface material (TIM), and solder balls. The substrate has an upper surface and a lower surface and further has a receiving area. The receiving area has a bottom in the substrate and an opening formed on the upper surface. Several solder bumps are disposed in the receiving area. The chip is disposed on the upper surface of the substrate, and covers the opening. The front surface of the chip is electrically coupled to the bottom via the solder bumps. The heat sink is attached to the upper surface of the substrate and the back surface of the chip through the adhesion of TIM. Several solder balls are disposed on the lower surface of the substrate.

REFERENCES:
patent: 6507119 (2003-01-01), Huang et al.
patent: 2004/0188814 (2004-09-01), Houle et al.

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