Flip chip package including a non-planar heat spreader and...

Details Flip chip package including a non-planar heat spreader and... Flip chip package including a non-planar heat spreader and...

2007-09-18

2007-09-18

Parekh, Nitin (Department: 2811)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Insulating material

C257S707000, C257S713000, C257S780000, C257S778000, C257SE23181

Reexamination Certificate

active

10979155

ABSTRACT:
A flip chip package generally includes a substrate, a flip chip die, and a heat spreader. The flip chip die is coupled to the substrate. The heat spreader is coupled to the flip chip die. The heat spreader can include one or more walls. Generally, the one or more walls at least partially laterally surround the flip chip die and/or the substrate. The walls can completely laterally surround the flip chip die to define a cavity in the heat spreader. The flip chip package can further include an encapsulate. For example, the encapsulate can be injected between the one or more walls of the heat spreader and the flip chip die and/or other components of the flip chip package. The encapsulate and/or the one or more walls of the heat spreader can protect one or more components of the flip chip package against moisture, corrosives, heat, or radiation, to provide some examples.

REFERENCES:
patent: 6008536 (1999-12-01), Mertol
patent: 6515870 (2003-02-01), Skinner et al.
patent: 6653730 (2003-11-01), Chrysler et al.
patent: 6819566 (2004-11-01), Danovitch et al.
patent: 2002/0012099 (2002-01-01), Miwa et al.
patent: 2002/0113306 (2002-08-01), Kwon et al.
patent: 2003/0025180 (2003-02-01), Alcoe et al.
Siliconware Precision Industries, “Flip Chip Package”, 5 pages, copyright Siliconware Precision Industries Co., Ltd., 2000-05.

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