Active solid-state devices (e.g. – transistors – solid-state diode – Responsive to non-electrical signal – Electromagnetic or particle radiation
Reexamination Certificate
2005-02-01
2005-02-01
Graybill, David E. (Department: 2827)
Active solid-state devices (e.g., transistors, solid-state diode
Responsive to non-electrical signal
Electromagnetic or particle radiation
C257S459000, C257S680000
Reexamination Certificate
active
06849916
ABSTRACT:
An image sensor package includes an image sensor having an active area and bond pads on a front surface of the image sensor. A window is mounted to the image sensor by flip chip bumps formed between the bond pads of the image sensor and interior traces on an interior surface of the window. The window has an area less than an area of the front surface of the image sensor. A bead is formed between the window and the front surface of the image sensor thus forming a sealed cavity in which the active area is located. The bead has sides coplanar with sides of the image sensor such that the image sensor package is chip size.
REFERENCES:
patent: 4801998 (1989-01-01), Okuaki
patent: 5194934 (1993-03-01), Yamazaki et al.
patent: 5222014 (1993-06-01), Lin
patent: 5231036 (1993-07-01), Miyauchi et al.
patent: 5463229 (1995-10-01), Takase et al.
patent: 5578525 (1996-11-01), Mizukoshi
patent: 5579207 (1996-11-01), Hayden et al.
patent: 5786589 (1998-07-01), Segawa et al.
patent: 5821532 (1998-10-01), Beaman et al.
patent: 5858815 (1999-01-01), Heo et al.
patent: 5867368 (1999-02-01), Glenn
patent: 5907151 (1999-05-01), Gramann et al.
patent: 5925898 (1999-07-01), Späth
patent: 5949655 (1999-09-01), Glenn
patent: 5962810 (1999-10-01), Glenn
patent: 5973337 (1999-10-01), Knapp et al.
patent: 5977624 (1999-11-01), Heo et al.
patent: 6005965 (1999-12-01), Tsuda et al.
patent: 6011310 (2000-01-01), Naito et al.
patent: 6028354 (2000-02-01), Hoffman
patent: 6046070 (2000-04-01), Shoji et al.
patent: 6122009 (2000-09-01), Ueda
patent: 6130448 (2000-10-01), Bauer et al.
patent: 6143981 (2000-11-01), Glenn
patent: 6144507 (2000-11-01), Hashimoto
patent: 6247229 (2001-06-01), Glenn
patent: 6281568 (2001-08-01), Glenn et al.
patent: 6291884 (2001-09-01), Glenn et al.
patent: 6342406 (2002-01-01), Glenn et al.
patent: 6396043 (2002-05-01), Glenn et al.
patent: 20010013653 (2001-08-01), Shoji
patent: 20020012234 (2002-01-01), Harada et al.
patent: 402278872 (1990-11-01), None
EE times, “Diminutive package holds Xicor E2Prom”, http://www.eetimes.com
ews/98/1022news/xicor.html, Aug. 17, 1998.*
EE Times, “Diminutive package holds Xicor E2PROM”; http://www.uic.com/wcms/wcms.nsf/index/White_Papers_7.html, Aug. 17, 1998.*
Substrate Technology Incorporated, “Glossary”, pp. 1-3; http://www.sti-dallas.com/library/glossary.asp; Date not available.*
Value Added Services, p. 1; http://www.valueaddedservices.net/glo.htm, Date not available.*
Lapp et al.,New Substrate for Advanced Flat Panel Display Applications, Product Information Sheet, 1994, 4 pages.
Corning Incorporated,1737 Sheet Glass, Product Information Sheet, revised 3/97, 2 pages.
Corning Incorporated,Industrial Grade Products, Product Information Sheet, revised 3/97, 2 pages.
Corning Incorporated,Code: 1737F, Material Information Sheet, issued 1/96, 5 pages.
Corning Incorporated,Display Grade Products, Product Information Sheet, revised 7/95, 4 pages.
Corning Incorporated,Score Cutting of 7059F and 1737F Sheet Glasses, Application Information Sheet, revised 4/96, 2 pages.
Glenn Thomas P.
Hollaway Roy Dale
Webster Steven
Amkor Technology Inc.
Graybill David E.
Gunnison McKay & Hodgson, L.L.P.
Hodgson Serge J.
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