Flip chip mounting method and bump forming method

Details Flip chip mounting method and bump forming method Flip chip mounting method and bump forming method

2008-04-30

2009-12-29

Lindsay, Jr., Walter L (Department: 2812)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Flip chip

C257S737000, C257SE23018, C156S556000

Reexamination Certificate

active

07638883

ABSTRACT:
A flip chip mounting method which is applicable to the flip chip mounting of a next-generation LSI and high in productivity and reliability as well as a bump forming method are provided. After a resin14containing a solder powder16and a gas bubble generating agent is supplied to a space between a circuit board21having a plurality of connecting terminals11and a semiconductor chip20having a plurality of electrode terminals12, the resin14is heated to generate gas bubbles30from the gas bubble generating agent contained in the resin14. The resin14is pushed toward the outside of the generated gas bubbles30by the growth thereof and self-assembled between the connecting terminals11and the electrode terminals12. By further heating the resin14and melting the solder powder16contained in the resin14self-assembled between the terminals, connectors22are formed between the terminals to complete a flip chip mounting body.

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