Flip chip mounting method and semiconductor apparatus manufactur

Details Flip chip mounting method and semiconductor apparatus manufactur Flip chip mounting method and semiconductor apparatus manufactur

1998-10-20

2000-10-24

Clark, Sheila V.

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Die bond

257782, H01L 2348, H01L 2352, H01L 2940

Patent

active

061371831

ABSTRACT:
An improved flip chip mounting method is provided for mounting an IC chip on a substrate. The IC chip has one surface and electrodes formed on the one surface, and the IC chip is positioned so that the electrodes oppose the substrate. The IC chip and the substrate are heat bonded to one another with a sheet of anisotropic conductive adhesive and paste-like adhesive being placed between the IC chip and the substrate.

REFERENCES:
patent: 5442240 (1995-08-01), Mukerji
patent: 5705852 (1998-01-01), Orihara et al.
patent: 5861661 (1999-01-01), Tang et al.

Affiliated with

Also associated with

Rating

Flip chip mounting method and semiconductor apparatus manufactur does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Flip chip mounting method and semiconductor apparatus manufactur, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Flip chip mounting method and semiconductor apparatus manufactur will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1966866