Flip chip package and method of making

Details Flip chip package and method of making Flip chip package and method of making

1993-01-04

1994-10-04

Mintel, William

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With provision for cooling the housing or its contents

257737, 257778, 437209, 437215, H01L 2348

Patent

active

053529260

ABSTRACT:
A portion of a semiconductor die is rigidly flip chip bonded to a conductive base plate and portion is bonded to a flexible dielectric material to take advantage of the benefits of flip chip packaging while at the same time allowing for heat to be dissipated and for differential thermal expansion to be relieved. A semiconductor die having at least a first and a second bump formed thereon is rigidly connected to the base plate through the first bump and is flexibly connected to the base plate through the second bump.

REFERENCES:
patent: 3471753 (1969-10-01), Burks et al.
patent: 3871015 (1975-03-01), Lin et al.
patent: 5077598 (1991-12-01), Bartelink
patent: 5250847 (1993-10-01), Baskett

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