Backside bus vias
Backside connection to TSVs having redistribution lines
Bond pad connection to redistribution lines having tapered...
Building metal pillars in a chip for structure support
Buried conductor patterns formed by surface transformation...
Buried conductors
Buried contact architecture
Chip stack package
Contact switch for high frequency application
Contact terminal element, contact terminal device
Detecting the endpoint of chem-mech polishing, and resulting sem
Diamond component with rear side contact and a method for...
Die stacking with an annular via having a recessed socket
Dual wired integrated circuit chips
Dual-sided semiconductor device with a resistive element...
Edge seal for thru-silicon-via technology
Electronic component with stacked semiconductor chips and...
Fin semiconductor device and method for fabricating the same
Front-end processing of nickel plated bond pads
High performance silicon contact for flip chip and a system...