Active solid-state devices (e.g. – transistors – solid-state diode – Physical configuration of semiconductor – With electrical contact in hole in semiconductor
Reexamination Certificate
2008-04-22
2010-10-26
Ho, Tu-Tu V (Department: 2818)
Active solid-state devices (e.g., transistors, solid-state diode
Physical configuration of semiconductor
With electrical contact in hole in semiconductor
C257S698000, C257S774000, C257S777000, C257S778000, C257SE23011, C438S667000, C438S459000
Reexamination Certificate
active
07821107
ABSTRACT:
A die stack including a die having an annular via with a recessed conductive socket and methods of forming the die stack provide a structure for use in a variety of electronic systems. In an embodiment, a die stack includes a conductive pillar on the top of a die inserted into the recessed conductive socket of another die.
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“International Application Serial No. PCT/US2009/002481, Search Report mailed Dec. 31, 2009”, 3 pgs.
“International Application Serial No. PCT/US2009/002481, Written Opinion mailed Dec. 31, 2009”, 4 pgs.
Ho Tu-Tu V
Micro)n Technology, Inc.
Schwegman Lundberg & Woessner, P.A.
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