Front-end processing of nickel plated bond pads

Details Front-end processing of nickel plated bond pads Front-end processing of nickel plated bond pads

2006-04-07

2009-02-03

Le, Dung A. (Department: 2818)

Active solid-state devices (e.g., transistors, solid-state diode

Physical configuration of semiconductor

With electrical contact in hole in semiconductor

C257S779000, C257S781000, C257SE21176

Reexamination Certificate

active

07485948

ABSTRACT:
A front-end method of fabricating nickel plated caps over copper bond pads used in a memory device. The method provides protection of the bond pads from an oxidizing atmosphere without exposing sensitive structures in the memory device to the copper during fabrication.

REFERENCES:
patent: 6825564 (2004-11-01), Gleason et al.
patent: 6946347 (2005-09-01), Gilton
patent: 2004/0036137 (2004-02-01), Gleason et al.
patent: 2004/0232551 (2004-11-01), Moore et al.
patent: 2005/0020069 (2005-01-01), Gleason et al.
patent: 2005/0194255 (2005-09-01), Tiwari
patent: 2006/0022352 (2006-02-01), Moore et al.

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