LandOfFree - US Patents - Listing for Active solid-state devices (e.g., transistors, solid-state diode,Lead frame

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With stress relief

Contact agency interposed between IC and IC receptacle

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – On insulating carrier other than a printed circuit board

Contact spring application to semiconductor devices

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame

Controlled impedance leads in a leadframe for high frequency...

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – On insulating carrier other than a printed circuit board

Controlling packaging encapsulant leakage

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With stress relief

Controlling warping in integrated circuit devices

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With stress relief

Controlling warping in integrated circuit devices

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame

Copper alloy sheet and QFN package

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame

Copper alloy sheet for electric and electronic parts

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With bumps on ends of lead fingers to connect to semiconductor

Copper interconnect for semiconductor device

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With stress relief

Copper straps

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame

Corner bonding to lead frame

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame

Corrosion-resistant lead frame

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – Small lead frame for connecting a large lead frame to a...

Coupling spaced bond pads to a contact

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – Small lead frame for connecting a large lead frame to a...

Coupling spaced bond pads to a contact

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – On insulating carrier other than a printed circuit board

Coupling spaced bond pads to a contact

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – On insulating carrier other than a printed circuit board

Cover tape for packaging electronic elements

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – On insulating carrier other than a printed circuit board

Cross grid array package structure and method of manufacture

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With dam or vent for encapsulant

Crushable bead on lead finger side surface to improve moldabilit

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With dam or vent for encapsulant

Crushable bead on lead finger side surface to improve moldabilit