Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With stress relief
Patent
1996-04-17
1998-08-04
Wojciechowicz, Edward
Active solid-state devices (e.g., transistors, solid-state diode
Lead frame
With stress relief
257672, 257673, 257674, 257688, 257689, 257696, 257773, H01L 23495
Patent
active
057898049
ABSTRACT:
Between an IC and an IC receptacle is interposed a flexible wiring sheet, via which contact pieces of the IC and contacts of the IC receptacle are held in contact with one another. In this case, lateral deviation and flexing of the wiring sheet are prevented satisfactorily, and proper contact between the IC and IC receptacle is ensured. A back-up frame is applied by adhesive to the flexible wiring sheet to form a contact agency. The back-up frame 11 has a central window 11 to form a non-backed-up region in a central portion of the flexible wiring sheet 3 that covers the window. The IC 3 and flexible wiring sheet are held in forced contact with each other in the non-backed-up region. The back-up frame has an outer edge portion forming a back-up region for backing up an edge portion of the wiring sheet. In this back-up region, the IC receptacle and the flexible wiring sheet 1 are held in contact with each other.
REFERENCES:
patent: 5389820 (1995-02-01), Matsuoka
patent: 5493150 (1996-02-01), Matsuoka et al.
patent: 5536969 (1996-07-01), Matsuoka
Matsuoka Noriyuki
Uratsuji Kazumi
Wojciechowicz Edward
Yamaichi Electronics Co. Ltd.
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