Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame
Reexamination Certificate
2007-09-26
2011-11-22
Tran, Minh-Loan T (Department: 2826)
Active solid-state devices (e.g., transistors, solid-state diode
Lead frame
C257S677000, C257S762000, C257SE23161
Reexamination Certificate
active
08063471
ABSTRACT:
A Cu—Fe—P alloy sheet that is provided with the high strength and with the improved resistance of peel off of oxidation film, in order to deal with problems such as package cracks and peeling, is provided. A copper alloy sheet for electric and electronic parts according to the present invention is a copper alloy sheet containing Fe: 0.01 to 0.50 mass % and P: 0.01 to 0.15 mass %, respectively, with the remainder of Cu and inevitable impurities. A centerline average roughness Ra is 0.2 μm or less and a maximum height Rmax is 1.5 μm or less, and Kurtosis (degree peakedness) Rku of roughness curve is 5.0 or less, in measurement of the surface roughness of the copper alloy sheet in accordance with JIS B0601.
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Aruga Yasuhiro
Miwa Yosuke
Ozaki Ryoichi
(Kobe Steel, Ltd.)
Arroyo Teresa M
Oblon, Spivak McClelland, Maier & Neustadt, L.L.P.
Tran Minh-Loan T
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