Crushable bead on lead finger side surface to improve moldabilit

Details Crushable bead on lead finger side surface to improve moldabilit Crushable bead on lead finger side surface to improve moldabilit

1999-03-22

2000-06-20

Guay, John

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

With dam or vent for encapsulant

257730, H01L 23495

Patent

active

060780983

ABSTRACT:
A surface mount semiconductor package employs locking elements for locking a plastic housing to a metal pad on which a semiconductor device is mounted. The package includes terminals having elongated crushable beads on their side surfaces adjacent the portions of the terminals just outside the plastic housing. The beads are crushed inwardly by a molding tool when it closes to provide a seal which prevents the molding plastic from bleeding out and over the sides of the terminals which extend beyond the housing and which could interfere with solder connection to the terminals.

REFERENCES:
patent: 4280132 (1981-07-01), Hayakawa et al
patent: 4977442 (1990-12-01), Suzuki et al.
patent: 5031022 (1991-07-01), Yamamoto et al.
patent: 5202577 (1993-04-01), Ichigi et al.
patent: 5285104 (1994-02-01), Kondo et al.
patent: 5689137 (1997-11-01), Weber
patent: 5886397 (1999-03-01), Ewer

Affiliated with

Also associated with

Rating

Crushable bead on lead finger side surface to improve moldabilit does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Crushable bead on lead finger side surface to improve moldabilit, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Crushable bead on lead finger side surface to improve moldabilit will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1855558