Corrosion-resistant lead frame

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame

Patent

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Details

257741, 257750, 257762, 257736, H01L 23495, H01L 2348, H01L 2352, H01L 2940

Patent

active

058380620

ABSTRACT:
A lead frame for a semiconductor chip package, including a die pad onto which a semiconductor chip will be attached; leads which will be electrically connected to the chip; and side rails supporting the leads and the die pad; a second metal being contact with the rails, this second metal having a higher standard electrode potential than that of the copper metal or alloy of which the remainder of the lead frame is made.

REFERENCES:
patent: 4707724 (1987-11-01), Suzuki et al.
patent: 5343073 (1994-08-01), Parthasarathi et al.
patent: 5459103 (1995-10-01), Kellecher et al.
patent: 5540378 (1996-07-01), Mahulikar et al.

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