Copper alloy sheet and QFN package

Details Copper alloy sheet and QFN package Copper alloy sheet and QFN package

2011-04-19

2011-04-19

Clark, S. V (Department: 2823)

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

C257S672000

Reexamination Certificate

active

07928541

ABSTRACT:
A QFN package is provided with a lead frame formed by processing a copper alloy sheet containing 0.01 to 0.50% by mass Fe, 0.01 to 0.20% by mass P, and Cu and inevitable impurities as other components, having a micro Vickers hardness of 150 or above, a uniform elongation of 5% or below and a local elongation of 10% or below, or a copper alloy sheet containing 0.05 to 2% by mass Ni, 0.001 to 0.3% by mass P, 0.005 to 5% by mass Zn, and Cu and inevitable impurities as other components, having a micro Vickers hardness of 150 or above, a uniform elongation of 5% or below and a local elongation of 10% or below. Lead burrs formed during the dicing of the QFN package are short, and a dicing blade used for dicing the QFN package is abraded at a low wear-out rate.

REFERENCES:
patent: 4605532 (1986-08-01), Knorr et al.
patent: 4632806 (1986-12-01), Morikawa et al.
patent: 6132529 (2000-10-01), Hatakeyama et al.
patent: 6558617 (2003-05-01), Miwa
patent: 6700192 (2004-03-01), Matsuzawa et al.
patent: 2006/0016528 (2006-01-01), Hatakeyama
patent: 2006/0137773 (2006-06-01), Aruga et al.
patent: 2006/0186544 (2006-08-01), Won et al.
patent: 2007/0092991 (2007-04-01), Masumoto
patent: 2009/0014102 (2009-01-01), Hatakeyama
patent: 101001965 (2007-07-01), None
patent: 1 612 285 (2006-01-01), None
patent: 2 088 214 (2009-08-01), None
patent: 2 158 095 (1985-11-01), None
patent: 2002-194461 (2002-07-01), None
patent: 2003-124420 (2003-04-01), None
patent: 2003-347494 (2003-12-01), None
patent: 2007-123327 (2007-05-01), None
U.S. Appl. No. 12/374,154, filed Jan. 16, 2009, Aruga, et al.
U.S. Appl. No. 12/441,904, filed Mar. 19, 2009, Aruga, et al.

Affiliated with

Also associated with

Rating

Copper alloy sheet and QFN package does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Copper alloy sheet and QFN package, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Copper alloy sheet and QFN package will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2620536