Copper straps

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With stress relief

Reexamination Certificate

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Details

C257S666000, C257S673000, C257SE23039

Reexamination Certificate

active

07859089

ABSTRACT:
A copper strap for a semiconductor device package having a contact electrically connected to a die electrode, a leg portion electrically connected to a lead frame, a web portion positioned between the contact and the leg portion and connected to the leg portion and a connection region connecting the web portion to the contact. The contact includes a body having a plurality of formations, each of the plurality of formations having a concavity and an opposing convexity positioned to generally face the die electrode.

REFERENCES:
patent: 4935803 (1990-06-01), Kalfus et al.
patent: 6459147 (2002-10-01), Crowley et al.
patent: 6521982 (2003-02-01), Crowley et al.
patent: 6545349 (2003-04-01), Iwaya et al.
patent: 6630726 (2003-10-01), Crowley et al.
patent: 6849930 (2005-02-01), Nakajima et al.
patent: 7081666 (2006-07-01), Joshi et al.
patent: 7683434 (2010-03-01), Agnello et al.
patent: 2005/0133893 (2005-06-01), Joshi et al.
patent: 2007/0290336 (2007-12-01), Sun et al.

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