Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With dam or vent for encapsulant
Patent
1997-08-21
1999-03-23
Chaudhuri, Olik
Active solid-state devices (e.g., transistors, solid-state diode
Lead frame
With dam or vent for encapsulant
257730, H01L 23495
Patent
active
058863974
ABSTRACT:
A surface mount semiconductor package employs locking elements for locking a plastic housing to a metal pad on which a semiconductor device is mounted. The package includes terminals having elongated crushable beads on their side surfaces adjacent the portions of the terminals just outside the plastic housing. The beads are crushed inwardly by a molding tool when it closes to provide a seal which prevents the molding plastic from bleeding out and over the sides of the terminals which extend beyond the housing and which could interfere with solder connection to the terminals.
REFERENCES:
patent: 4280132 (1981-07-01), Hayakawa et al.
patent: 4977442 (1990-12-01), Suzuki et al.
patent: 5031022 (1991-07-01), Yamamoto et al.
patent: 5202577 (1993-04-01), Ichigi et al.
patent: 5285104 (1994-02-01), Kondo et al.
Chaudhuri Olik
International Rectifier Corporation
Kelley Nathan K.
LandOfFree
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