Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – On insulating carrier other than a printed circuit board
Reexamination Certificate
2005-06-21
2005-06-21
Chambliss, Alonzo (Department: 2814)
Active solid-state devices (e.g., transistors, solid-state diode
Lead frame
On insulating carrier other than a printed circuit board
C257S672000, C029S827000
Reexamination Certificate
active
06909167
ABSTRACT:
Two dice may be provided within a single package so that one pin and associated leadfinger may be coupled to bond pads on different dice. This may mean that two different bond pads on different dice are coupled, for example by wirebonding, to the same leadfinger. An adhesive tape may be secured so as to bridge the two dice. One or more conductive traces are formed on the upper side of the adhesive tape and adhesive is provided on the other side to secure the tape to the two dice. As a result, wire bonds may be made from a pad on one die to a trace and then from the opposite side of the trace to a leadfinger. At the same time, a wire bond may be made from a pad on the other die to the same leadfinger. In another embodiment, an adhesive tape with a conductive trace on it may be used as a wire bond bridge to join spaced bond pads on a single chip.
REFERENCES:
patent: 5691567 (1997-11-01), Lo et al.
patent: 6104084 (2000-08-01), Ishio et al.
patent: 6453547 (2002-09-01), Yang
patent: 6580160 (2003-06-01), Yang
patent: 6768187 (2004-07-01), Yang
Baunson M.
Chambliss Alonzo
Micro)n Technology, Inc.
Trop Pruner & Hu P.C.
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