LandOfFree - US Patents - Listing for Active solid-state devices (e.g., transistors, solid-state diode,Lead frame

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Semiconductor package with controlled solder bump wetting

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With bumps on ends of lead fingers to connect to semiconductor

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Semiconductor package with controlled solder bump wetting

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With bumps on ends of lead fingers to connect to semiconductor

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Semiconductor package with die pad having recessed portion

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With structure for mounting semiconductor chip to lead frame

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Semiconductor package with exposed die pad and body-locking...

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With structure for mounting semiconductor chip to lead frame

Reexamination Certificate

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Semiconductor package with exposed die pad and body-locking...

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame

Reexamination Certificate

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Semiconductor package with half-etched locking features

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame

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Semiconductor package with heat dissipating structure

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With heat sink means

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Semiconductor package with heat spreader

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With heat sink means

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Semiconductor package with improved cross talk and...

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – On insulating carrier other than a printed circuit board

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Semiconductor package with improved moisture vapor relief functi

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With dam or vent for encapsulant

Patent

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Semiconductor package with increased number of input and...

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With structure for mounting semiconductor chip to lead frame

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Semiconductor package with increased number of input and...

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With structure for mounting semiconductor chip to lead frame

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Semiconductor package with inner leads exposed from an...

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With structure for mounting semiconductor chip to lead frame

Reexamination Certificate

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Semiconductor package with metal pads

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame

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Semiconductor package with molded plastic body

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With heat sink means

Patent

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Semiconductor package with no void in encapsulant and method...

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame

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Semiconductor package with passive device integration

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – Small lead frame for connecting a large lead frame to a...

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Semiconductor package with recessed leadframe and a recessed...

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame

Reexamination Certificate

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Semiconductor package with segmented lead frame

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame

Patent

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Semiconductor package with singulation crease

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame

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