Semiconductor package with heat spreader

Details Semiconductor package with heat spreader Semiconductor package with heat spreader

2007-03-27

2007-03-27

Huynh, Andy (Department: 2818)

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

With heat sink means

C257S276000, C257S625000, C257S706000, C257S707000, C257SE23069, C257SE23092

Reexamination Certificate

active

10963280

ABSTRACT:
A semiconductor package with heat spreader is disclosed. In one embodiment, the semiconductor package comprises a device carrier having a plurality of contact areas and a semiconductor die having a plurality of die pads of an active surface, the semiconductor die being mounted on the device carrier. Connection means to electrically connect the die pads to the contact areas and a heat spreading means mounted on the active surface of the die are provided. The heat spreading means includes an upper plate and a foot ring which protrudes from a bottom surface of the upper plate and which is positioned between the die pads on the active surface such that a cavity is formed between the heat spreading means and the active surface. The cavity is filled with an adhering means interconnecting the heat spreading means and the active surface.

REFERENCES:
patent: 5156923 (1992-10-01), Jha et al.
patent: 5349237 (1994-09-01), Sayka et al.
patent: 5358795 (1994-10-01), Nakamura et al.
patent: 5681663 (1997-10-01), Schaller et al.
patent: 5736785 (1998-04-01), Chiang et al.
patent: 6339254 (2002-01-01), Venkateshwaran et al.
patent: 6429513 (2002-08-01), Shermer, IV et al.
patent: 6444498 (2002-09-01), Huang et al.
patent: 6570764 (2003-05-01), Bhatia et al.
patent: 2003/0006501 (2003-01-01), Waki et al.
patent: 2003/0020151 (2003-01-01), Chen et al.
patent: 2003/0116836 (2003-06-01), Huang et al.
patent: 2005/0093135 (2005-05-01), Liu et al.
patent: 09260555 (1997-10-01), None
patent: 11297901 (1999-10-01), None
patent: 11297901 (1999-10-01), None
A copy of Austrian Search Report mailed Sep. 5, 2005 (7 pgs.).

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