Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame
Reexamination Certificate
2008-05-06
2010-10-05
Tran, Thien F (Department: 2895)
Active solid-state devices (e.g., transistors, solid-state diode
Lead frame
C257S670000, C257S676000, C257SE23031
Reexamination Certificate
active
07808084
ABSTRACT:
Disclosed is a lead frame, a semiconductor device and a fabrication method related to the semiconductor device. Since the lead frame has a land connecting bar, an upper surface of which is half-etched, the land connecting bar is more easily removed by a blade than a conventional land connecting bar in a fabrication process for the semiconductor device. Accordingly, stress applied to the lands when the land connecting bar is removed is reduced, and a flatness of the lands is maintained. Also, first and second lands constituting the lands are alternately formed with the land connecting bar, leads are alternately formed with the second lands, and wire bonding regions of the leads are positioned on a plane higher than the second lands. Accordingly, an interval between the conductive wires can be constantly maintained and the conductive wires have different traces, thus preventing a short between the conductive wires due to wire sweeping in an encapsulation process.
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paten
Lee Chang Deok
Na Do Hyun
Amkor Technology Inc.
Stetlina Brunda Garred & Brucker
Tran Thien F
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