Semiconductor package with exposed die pad and body-locking...

Details Semiconductor package with exposed die pad and body-locking... Semiconductor package with exposed die pad and body-locking...

2005-01-25

2005-01-25

Fahmy, Wael (Department: 2814)

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

With structure for mounting semiconductor chip to lead frame

C257S666000, C257S667000, C257S668000

Reexamination Certificate

active

06847103

ABSTRACT:
A very thin, small outline, thermally enhanced semiconductor package includes a leadframe that is coined to form locking features on an exposed die pad and on a plurality of extremely narrow, closely spaced leads. The coined features improve the mechanical locking between the leadframe and the plastic body of the package to increase their resistance to delamination and subsequent penetration by moisture, and enable reliable wire bonds to be made to the otherwise extremely narrow leads.

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