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Packing structure of semiconductor packages

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With structure for mounting semiconductor chip to lead frame
Patent

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Pad structures to improve board-level reliability of...

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With stress relief
Reexamination Certificate

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Paddleless molded plastic semiconductor chip package

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With structure for mounting semiconductor chip to lead frame
Patent

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Palladium-spot leadframes for high adhesion semiconductor...

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – Of specified material other than copper
Reexamination Certificate

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Palladium-spot leadframes for solder plated semiconductor...

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame
Reexamination Certificate

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Partially patterned lead frames and methods of making and...

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame
Reexamination Certificate

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Personalized area leadframe coining or half etching for reduced

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With stress relief
Patent

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Piggyback multiple dice assembly

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With stress relief
Reexamination Certificate

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Planarized plastic package modules for integrated circuits

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With separate tie bar element or plural tie bars
Reexamination Certificate

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Plastic and grid array semiconductor device and method for makin

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame
Patent

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Plastic body surface-mounting semiconductor power device having

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With heat sink means
Patent

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Plastic encapsulated IC package and method of designing same

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame
Patent

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Plastic encapsulated semiconductor device and lead frame

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame
Patent

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Plastic encapsulated semiconductor device and method of manufact

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame
Patent

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Plastic image sensor packaging for image sensors

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With dam or vent for encapsulant
Reexamination Certificate

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Plastic integrated circuit package and leadframe for making...

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With separate tie bar element or plural tie bars
Reexamination Certificate

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Plastic integrated circuit package and method and leadframe...

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame
Reexamination Certificate

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Plastic integrated circuit package and method and leadframe...

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame
Reexamination Certificate

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Plastic lead frames for semiconductor devices

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With structure for mounting semiconductor chip to lead frame
Patent

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Plastic lead frames for semiconductor devices

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With structure for mounting semiconductor chip to lead frame
Reexamination Certificate

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