Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With heat sink means
Patent
1997-01-24
1998-12-22
Thomas, Tom
Active solid-state devices (e.g., transistors, solid-state diode
Lead frame
With heat sink means
257678, 257706, 257712, 257717, 257720, 257713, 257796, H01L 23433, H01L 2331
Patent
active
058523243
ABSTRACT:
A QFP plastic surface-mounting semiconductor power device, comprising a plastic package inside which there is provided a chip which is connected by means of conductors to terminals that protrude from the plastic package, and a heat sink plate that is arranged on the bottom of the plastic package and has thinner ends, wherein the length of the heat sink plate is at least equal to the minimum length of the plastic package, channels being formed in the plastic package in a position that is adjacent to the thinner ends of the heat sink plate.
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Mazzola Mauro
Poinelli Renato
SGS--Thomson Microelectronics S.r.l.
Thomas Tom
Williams Alexander Oscar
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