Plastic encapsulated semiconductor device and lead frame

Details Plastic encapsulated semiconductor device and lead frame Plastic encapsulated semiconductor device and lead frame

1993-09-08

1994-10-18

Nguyen, Viet Q.

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

257668, 257669, 257670, 257675, 257676, H01L 2350, H01L 2348

Patent

active

053571398

ABSTRACT:
In a package for DRAM, plastic is included between the common signal inner leads (bus bar inner leads) and insulating films arranged in the central part of a semiconductor chip. Thus, the deformation of plastic at the upper edge of the common signal inner leads is reduced and no great stress is generated at this portion. Accordingly, plastic cracking can be prevented.

REFERENCES:
patent: 4445271 (1984-05-01), Grabbe
patent: 4862245 (1989-08-01), Pashby et al.
patent: 4862246 (1989-08-01), Masuda et al.
patent: 4916519 (1990-04-01), Ward
patent: 4951122 (1990-08-01), Tsubosaki et al.
patent: 4984065 (1991-01-01), Sako
patent: 5032895 (1991-07-01), Horiuchi et al.
"Thin Small Outline Package", IBM TDB, vol. 34, No. 1, Jun. 1991, pp. 358-359.
William Ward, "Volume Production of Plastic Modules for Dram Chip by Area Wire Bond Techniques", IBM, IEEE, 1988, pp. 552-557.

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