Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame
Patent
1997-02-07
1998-06-30
Jackson, Jerome
Active solid-state devices (e.g., transistors, solid-state diode
Lead frame
257669, 257787, H01L 23495
Patent
active
057738777
ABSTRACT:
A method for designing an IC package having a plastic encapsulated portion and a lead frame portion that are bonded together at a bonding interface includes selecting material candidates for each of the plastic encapsulated portion and the lead frame potion to obtain possible material combinations. A peeling stress and a shear stress at the bonding interface for each possible material combination is determined. A design material combination from all of the possible material combinations is then selected based on a singularity parameter and stress intensity factors of the peeling stress and the shear stress. To enhance the IC package, a circular fillet feature having a radius is added to a singularity point at the bonding interface of the IC package to reduce the stress at the singularity point. The value of the radius is determined from a predefined range of radii based on the singularity parameter and stress intensity factors of the peeling stress and the shear stress at the singularity point for each of the radii.
REFERENCES:
patent: 4866506 (1989-09-01), Nambu et al.
patent: 5182630 (1993-01-01), Omi et al.
patent: 5313102 (1994-05-01), Lim et al.
Hu Jun Min
Pao Yi-Hsi
Clark S. V.
Dixon Richard D.
Ford Motor Company
Jackson Jerome
May Roger L.
LandOfFree
Plastic encapsulated IC package and method of designing same does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Plastic encapsulated IC package and method of designing same, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Plastic encapsulated IC package and method of designing same will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-1862881