Plastic lead frames for semiconductor devices

Details Plastic lead frames for semiconductor devices Plastic lead frames for semiconductor devices

1998-11-17

2000-07-18

Monin, Jr., Donald L.

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

With structure for mounting semiconductor chip to lead frame

257672, 257735, 257782, 257783, H01L 23495

Patent

active

060911360

ABSTRACT:
A conductive plastic lead frame and method of manufacturing same suitable for use in IC packaging. In a preferred embodiment, the lead frame is constructed of a plastic or polymer based lead frame structure with an intrinsic conductive polymer coating. In a second embodiment the lead frame is a composite plastic or polymeric material intermixed with an intrinsic conductive polymer coating.

REFERENCES:
patent: 3440027 (1969-04-01), Hugle
patent: 3868765 (1975-03-01), Hartleroad et al.
patent: 4079551 (1978-03-01), Grabbe
patent: 4089733 (1978-05-01), Zimmerman
patent: 4234666 (1980-11-01), Gursky
patent: 4281556 (1981-08-01), Weishew
patent: 4677526 (1987-06-01), Muehling
patent: 4906802 (1990-03-01), Castleman
patent: 5231756 (1993-08-01), Tokita et al.
patent: 5341027 (1994-08-01), Park et al.
patent: 5446570 (1995-08-01), Kaneko et al.
patent: 5600179 (1997-02-01), Suzuki
patent: 5612259 (1997-03-01), Okutomo et al.
patent: 5616953 (1997-04-01), King et al.
patent: 5770479 (1996-01-01), Brooks et al.
patent: 5840214 (1998-11-01), Kinlen
patent: 5879965 (1999-03-01), Jiang et al.
Rao R. Tummala et al., "Microelectronics Packaging Handbook", pp. 544-548.

Affiliated with

Also associated with

Rating

Plastic lead frames for semiconductor devices does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Plastic lead frames for semiconductor devices, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Plastic lead frames for semiconductor devices will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2039525