Plastic image sensor packaging for image sensors

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With dam or vent for encapsulant

Reexamination Certificate

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Details

C257S680000, C257S704000, C257S774000, C257SE31118, C257SE31128

Reexamination Certificate

active

07915717

ABSTRACT:
A package for an image sensor includes a lead frame having a first surface and a second surface opposite the first surface; an image sensor mounted on the first surface of the lead frame; an optical cover spanning the first surface; and a plastic, optically transparent window in the optical cover and aligned with the image sensor.

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