LandOfFree - US Patents - Listing for Active solid-state devices (e.g., transistors, solid-state diode,Lead frame

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With structure for mounting semiconductor chip to lead frame

Leadframe for leadless package, structure and manufacturing...

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame

Leadframe for molded semiconductor package and semiconductor...

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With dam or vent for encapsulant

Leadframe for packaged electronic device with enhanced mold...

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame

Leadframe for semiconductor chips and electronic devices and...

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame

Leadframe for semiconductor chips and semiconductor module havin

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame

Leadframe for semiconductor devices

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With dam or vent for encapsulant

Leadframe for semiconductor devices

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame

Leadframe for semiconductor package and mold for molding the...

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame

Leadframe for use in a semiconductor package

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With separate tie bar element or plural tie bars

Leadframe having a mold inflow groove and method for making

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With dam or vent for encapsulant

Leadframe having a particular dam bar

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame

Leadframe having contact pads defined by a polymer insulating fi

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With structure for mounting semiconductor chip to lead frame

Leadframe having continuously reducing width and semiconductor d

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame

Leadframe having delamination resistant die pad

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With structure for mounting semiconductor chip to lead frame

Leadframe having die attach pad with delamination and...

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame

Leadframe having exposed, solderable outer lead ends

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame

Leadframe having metal impregnated silicon carbide mounting area

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With structure for mounting semiconductor chip to lead frame

Leadframe having one or more power/ground planes without vias

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame

Leadframe having resilient carrier positioning means