Leadframe for packaged electronic device with enhanced mold...

Details Leadframe for packaged electronic device with enhanced mold... Leadframe for packaged electronic device with enhanced mold...

2008-04-08

2010-11-16

Ho, Tu-Tu V (Department: 2818)

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

With dam or vent for encapsulant

C257S676000, C257SE23037, C257SE23050

Reexamination Certificate

active

07834431

ABSTRACT:
A packaged electronic device (20) includes a die pad (30), leads (32) arranged around the die pad (30), and a die (24) attached to an upper surface (34) of the die pad (30) and electrically connected to the leads (32). A packaging material (28) encapsulates the die pad (30), the die (24), and the leads (32). The die pad (30) includes indentations (42) formed in the upper surface (34) along a sidewall (38) of the die pad (30). The die pad (30) further includes indentations (44) formed in a lower surface (36) of the die pad (30) along the sidewall. The packaging material (28) fills the indentations (42, 44) thereby promoting adhesion between the die pad (30) and the packaging material (28) so that the die pad (30) and packaging material (28) cannot readily delaminate.

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PCT Search Report and Written Opinion, PCT/US2009/034073, Mailed Jul. 23, 2009.

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